By leveraging the patented and volume-proven Nasiri-Fabrication platform, which integrates MEMS wafers with companion CMOS electronics through wafer-level bonding, InvenSense has driven the ITG-3200 package size down to a revolutionary footprint of 4x4x0.9mm (QFN), while providing the highest performance, lowest noise, and the lowest cost semiconductor packaging required for handheld consumer electronic devices. The part features a robust 10,000g shock tolerance, as required by portable consumer equipment.
For enhanced power supply flexibility, the ITG-3200 offers a separate VLOGIC reference pin in addition to its analog supply pin, which sets the logic levels of its IC interface. The VLOGIC voltage may be anywhere from 1.71V min to VDD max.
If you are interested in Internet of Things (IoT) or M2M projects check our open source sensor platform Waspmote which counts with more than 100 sensors available to use 'off the shelf', a complete API with hundreds of ready to use codes and a low consumption mode of just 0.7µA to ensure years of battery life.
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